| SEC1222 |
Light paste |
Highly silver filled electrically conductive epoxy adhesive. Room temperature cure with high strength and good temperature resistance. |
1 hour |
80D |
1/1 volume |
-40° to 150°C |
 |
 |
| SEC1233 |
Light paste |
Highly silver filled electrically conductive epoxy adhesive. Room temperature cure with high strength and excellent flexibilty. Suitable for use in DS-4 dual syringe. |
1 hour |
50D |
1/1 volume |
-40° to 150°C |
|
|
| SEC1244 |
Light paste |
Highly silver filled electrically conductive epoxy adhesive. High temperature snap cure with high strength and excellent temperature resistance and stabilty. |
>24 hours |
80D |
1/1 volume |
-40° to 180°C |
|
|
Resinlab offers a line of RoHS compliant stock and custom silver filled electrically conductive adhesives which provide electrical pathways for applications which cannot withstand the heat of solder. Typical applications are disk drive, flip-chip and die attach assembly. Most systems are available as two part mix-in format or pre-mixed and frozen. Some systems are suitable for using the DS-4 dual syringe.