Resinlab offers a line of RoHS compliant stock and custom silver filled electrically conductive adhesives which provide electrical pathways for applications which cannot withstand the heat of solder. Typical applications are disk drive, flip-chip and die attach assembly. Most systems are available as two part mix-in format or pre-mixed and frozen. Some systems are suitable for using the DS-4 dual syringe.

Silver Conductives

Product Name	Mixed Viscosity	Product's Key Features	Viscosity	Pot Life	Shore Hardness	Mix Ratio	Temp. Range	Docs
SEC1222	Light paste	Highly silver filled electrically conductive epoxy adhesive. Room temperature cure with high strength and good temperature resistance.	318,500	45 minutes	80D	1/1 volume	-40° to 150°C
SEC1233	Light paste	Highly silver filled electrically conductive epoxy adhesive. Room temperature cure with high strength and excellent flexibilty. Suitable for use in DS-4 dual syringe.	172,000	1 hour	50D	1/1 volume	-40° to 150°C
SEC1244	Light paste	Highly silver filled electrically conductive epoxy adhesive. High temperature snap cure with high strength and excellent temperature resistance and stabilty.	234,000	>24 hours	80D	1/1 volume	-40° to 180°C