Thermally Conductive Adhesives

Resinlab offers a line of stock and custom thermally conductive adhesives.

Most systems are aluminum oxide filled for applications where electrical isolation is required. Other one and two part systems use aluminum powder fillers for structural applications where dielectric properties are not critical.

For even higher performance, we also offer highly customized boron nitride one part premixed and frozen systems for demanding applications.

Product Name	Mixed Viscosity	Product's Key Features	Pot Life	Shore Hardness	Mix Ratio	Temp. Range
EP 950 G Gray	750,000 cps	One part heat cure aluminum filled, non sag viscosity thermally conductive epoxy adhesive. Cures to a rigid high modulus polymer with exceptional impact and shear strength.	3 months at 25°C	85 D	N/A	-40° to 150°C
EP 1121-4 Black	850,000 cps	Highly filled, thixotropic thermally conductive epoxy adhesive. Cures to a soft flexible polymer with a low CTE and shrinkage.	40-90 minutes	68-84 D	1/1 volume	-40° to 150°C
EP 1306	350,000 cps	Aluminum filled, thixotropic thermally conductive structural epoxy adhesive. Not recommended for electrical applications.	60-90 minutes	80 D	2/1 volume	-40° to 150°C
EP 1330	500,000 cps	One part heat cure highly filled, non sag viscosity thermally conductive epoxy adhesive. Cures quickly to a rigid high modulus polymer with a low CTE and shrinkage.	6 months @5C	90 D	N/A	-40° to 150°C
EP 1330 LV	250,000 cps	One part heat cure highly filled, medium viscosity thermally conductive epoxy adhesive / encapsulant. Cures quickly to a rigid high modulus polymer with a low CTE and shrinkage.	6 months @5C	90 D	N/A	-40° to 150°C