Thermally Conductive Adhesives
Thermally Conductive Adhesives
Resinlab offers a line of
stock and custom thermally conductive adhesives.
Most systems are aluminum oxide filled for applications where electrical
isolation is required. Other one and two part systems use aluminum powder
fillers for structural applications where dielectric properties are not
critical.
For even higher performance, we also offer highly customized boron nitride one part premixed and frozen systems for demanding applications.
| Product Name | Mixed Viscosity | Product's Key Features | Pot Life | Shore Hardness | Mix Ratio | Temp. Range | Docs |
|---|---|---|---|---|---|---|---|
| EP 950 G Gray | 750,000 cps | One part heat cure aluminum filled, non sag viscosity thermally conductive epoxy adhesive. Cures to a rigid high modulus polymer with exceptional impact and shear strength. | 3 months at 25°C | 65 D | N/A | -40° to 150°C |
 |
| EP 1121-4 Black | 850,000 cps | Highly filled, thixotropic thermally conductive epoxy adhesive. Cures to a soft flexible polymer with a low CTE and shrinkage. | 90-120 minutes | 95 A | 1/1 volume | -40° to 150°C |
|
| EP 1306 | 350,000 cps | Aluminum filled, thixotropic thermally conductive structural epoxy adhesive. Not recommended for electrical applications. | 60-90 minutes | 80 D | 2/1 volume | -40° to 150°C |
|
| EP 1330 | 500,000 cps | One part heat cure highly filled, non sag viscosity thermally conductive epoxy adhesive. Cures quickly to a rigid high modulus polymer with a low CTE and shrinkage. | 6 months @5C | 90 D | N/A | -40° to 150°C |
|
| EP 1330 LV | 250,000 cps | One part heat cure highly filled, medium viscosity thermally conductive epoxy adhesive / encapsulant. Cures quickly to a rigid high modulus polymer with a low CTE and shrinkage. | 6 months @5C | 90 D | N/A | -40° to 150°C |
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