ResinLab SEC1222 is a silver-filled, two component epoxy adhesive designed to cure completely at room temperature. It has excellent electrical conductivity useful in many electronic applications. It is a soft, 100% solids thixotropic paste provided in a 1:1 ratio.
For sizes and pricing please contact a ResinLab representative.
| SDS | SEC1222 Part A |
| SDS | SEC1222 Part B |
| TDS | SEC1222 A/B |
| Brochure | Electronic Applications |
Additional sizes and custom packaging solutions available. Learn more