Resinlab is one of America’s premier custom formulators – specializing in epoxy encapsulants for nearly any electronic product application. An encapsulant, also know as a potting compound, is designed to electrically insulate and environmentally protect from moisture, chemicals, mechanical/thermal shock and vibration.
Epoxy encapsulants offer superior resistance to environmental hazards such as high temperatures and chemical exposure. In addition, our epoxy encapsulants process easily and are friendly to the environment and the workplace. Our array of potting compounds also provides proprietary design security, tamper-proofing and thermal management for a broad range of electrical and electronic products. We formulate all of our products with the application process in mind – resulting in efficient, worker-safe and cost-effective manufacturing.| Product Name | Mixed Viscosity | Substrate's Key Features | Pot Life | Shore Hardness | Mix Ratio | Temperature Range | MSDS | TDS |
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| EP 691 Clear | 6,500 cps | Optically clear, long pot life, suitable for medium to large castings. | 60-90 Minutes | 80D | 2/1 volume | -40° to 150°C |  |
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| EP 965 Clear | 7,000 cps | Medium viscosity, small to medium mass potting. Good thermal shock and cycle resistance, fast cure to handle time. High gloss, low blush finish. | 20-30 minutes | 80D | 1/1 volume | -40° to 150°C | |
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| EP 965 Black | 7,000 cps | Medium viscosity, small to medium mass potting. Good thermal shock and cycle resistance, fast cure to handle time. High gloss, low blush finish. | 20-30 minutes | 80D | 1/1 volume | -40° to 150°C | |
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| EP 965 SC7 Clear | 5,000 cps | Medium viscosity, low exotherm, large mass potting. Extended worktime version of EP 965, good clarity and UV stability. | 45-60 minutes | 80D | 1/1 volume | -40° to 150°C | |
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| EP 965 SC7 Black | 5,000 cps | Medium viscosity, low exotherm, large mass potting. Extended worktime version of EP 965, high gloss, low blush surface. | 45-60 minutes | 80D | 1/1 volume | -40° to 150°C | |
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| EP 965 LVLX Clear | 2,200 cps | Low viscosity, low exotherm, fast curing potting. Suitable for small mass, high production rate assembly. Excellent air release and substrate wetting. | 8-12 minutes | 80D | 1/1 volume | -40° to 121°C | |
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| EP 965 LVLX Black | 2,200 cps | Low viscosity, low exotherm, fast curing potting. Suitable for small mass, high production rate assembly. Excellent air release and substrate wetting. | 8-12 minutes | 80D | 1/1 volume | -40° to 121°C | |
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| EP 1046 FG Clear | 1,200 cps | Low viscosity, low exotherm, very fast curing potting. Suitable for small mass, high production rate assembly. Excellent air release and substrate wetting. | 2-3 minutes | 80D | 1/1 volume | -40° to 150°C | |
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| EP 1046 FG Black | 2,000 cps | Low viscosity, low exotherm, very fast curing potting. Suitable for small mass, high production rate assembly. Excellent air release and substrate wetting. | 2-3 minutes | 80D | 1/1 volume | -40° to 150°C | |
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| EP 1056 LV Black | 7,000 cps | Excellent adhesion to PVC wire and shells, most engineering thermoplastics and other hard to bond surfaces. | 20-30 minutes | 80D | 2/1 volume | -40° to 150°C | |
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| EP 1112 NC Clear | 1,200 cps | Low viscosity, moderate exotherm, medium fast curing potting material. Suitable for small mass, high production rate assembly. | 8-12 minutes | 70D | 1/1 volume | -40° to 121°C | |
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| EP 1112 NC Black | 1,200 cps | Low viscosity, moderate exotherm, medium fast curing potting material. Suitable for small mass, high production rate assembly. | 8-12 minutes | 70D | 1/1 volume | -40° to 121°C | |
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| EP 1121 Clear | 2,500 cps | Low cost, low viscosity, low durometer, long pot life, flexible potting material. Excellent for low stress surface mount components or materials of differing CTE's. | 60-90 minutes | 40D | 1/1 volume | -40° to 150°C | |
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| EP 1121 Black | 2,500 cps | Low cost, low viscosity, low durometer, long pot life, flexible potting material. Excellent for low stress surface mount components or materials of differing CTE's. | 60-90 minutes | 40D | 1/1 volume | -40° to 150°C | |
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| EP 1282 Clear | 3,000 cps | Low viscosity, low durometer, long pot life, flexible potting material. Excellent for low stress surface mount components or materials of differing CTE's. Higher elongation and strength than EP 1121. | 90-120 minutes | 40D | 1/1 volume | -40° to 150°C | |
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| EP 1282 Black | 3,000 cps | Low viscosity, low durometer, long pot life, flexible potting material. Excellent for low stress surface mount components or materials of differing CTE's. Higher elongation and strength than EP 1121. | 90-120 minutes | 40D | 1/1 volume | -40° to 150°C | |
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| EP 1296 Black | 12,000 cps | Highly filled, moderately thixotropic black casting resin designed for applications requiring good thermal conductivity, low shrinkage and a low CTE | 60-90 minutes | 80D | 1/1 volume | -40° to 150°C | |
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| EP 1300 Clear | 10,000 cps | Medium viscosity, medium to large mass potting compound. Excellent thermal shock and cycle resistance, non-corrosive to copper, good retention of electrical properties under high humidity. Super high gloss, no blush finish. | 1 hour | 80D | 1/1 volume | -40° to 150°C | |
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| EP 1300 Black | 10,000 cps | Medium viscosity, medium to large mass potting compound. Excellent thermal shock and cycle resistance, non-corrosive to copper, good retention of electrical properties under high humidity. Super high gloss, no blush finish. | 1 hour | 80D | 1/1 volume | -40° to 150°C | |
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| EP 1305 LV Black | 25,000 cps | Fast curing potting material, excellent adhesion to PVC wire and chells, most engineering thermoplastics. Excellent water resistance and thermal cycle characteristics. | 15 minutes | 70D | 1/1 volume | -40° to 150°C | |
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| EP 1310 Clear | 6,000 cps | UV initiated 2-part room temp/shadow cure. Excellent water and chemical resistance. Suitable for medium to large castings, good optical clarity. | 15-25 minutes | 80D | 2/1 volume | -40° to 150°C | |
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