Thermally Conductive Encapsulants - Resinlab
Resinlab's thermally conductive encapsulants are designed to help dissipate heat from sensitive electronic components to extend the life span of devices. Most standard systems contain aluminum oxide filler which also reduces the CTE, reducing physical stresses during thermal cycling.
We maximize thermal conductivity by using a unique distribution of particles allowing for the highest filler content, while maintaining relatively low viscosity. EP 1200 is a unique product by being a friendly 1/1 volume ratio and quite stable in side-by-side dispensing cartridges.
For even higher performance, we offer a range of custom resin systems containing fillers such as boron nitride and aluminum nitride.