Resinlab thermally conductive encapsulants are designed to help dissipate heat from sensitive electronic components to extend the life span of devices. Most standard systems contain aluminum oxide filler which also reduces the CTE, reducing physical stresses during thermal cycling. We maximize thermal conductivity by using a unique distribution of particles - allowing for the highest filler content, while maintaining relatively low viscosity. EP 1200 is a unique product by being a friendly 1/1 volume ratio and quite stable in side-by-side dispensing cartridges. For even higher performance, we offer a range of custom resin systems containing fillers such as boron nitride and aluminum nitride.
| Product Name | Mixed Viscosity | Substrates and Key Features | Pot Life | Shore Hardness | Mix Ratio | Temp. Range | MSDS | TDS |
|---|---|---|---|---|---|---|---|---|
| EP1121-4 Black | 850,000 cps | Highly filled, thixotropic thermally conductive epoxy adhesive. Cures to a soft, flexible polymer with a low CTA and shrinkage | 30-45 minutes | 90 A | 1/1 volume | -40 to 121°C |  |
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| EP1200 BLACK | 28,000 cps | Highly filled, medium viscosity thermally conductive epoxy encapsulant. Cures to a soft flexible polymer with a low CTE and shrinkage. | 60-90 minutes | 90 A | 1/1 volume | -40 to 150°C | |
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| EP1200LV BLACK | 8,000 cps | Moderately filled, very low viscosity thermally conductive epoxy encapsulant. Cures to a soft flexible polymer with a low CTE and shrinkage. | 60-90 minutes | N/A | 1/1 volume | -40 to 150°C | |
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| EP1285 BLACK | Varies | Very highly filled, medium viscosity thermally conductive epoxy encapsulant. Cures to a rigid high modulus polymer with a low CTE and shrinkage. Available with various hardeners for a choice of viscosities, cure speed and temperature resistance. | Varies | 90D | Varies with catalyst | Varies with catalyst | |
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| EP1330LV | 200,000 cps | One part heat cure highly filled, medium viscosity thermally conductive epoxy adhesive / encapsulant. Cures quickly to a rigid high modulus polymer with a low CTE and shrinkage. | 6 months @5C | 85D | N/A | -40° to 150°C | |
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