EP1325 BLACK GL

ResinLab EP1325 Black Epoxy Adhesive

ResinLab EP1325 Black is a one component, heat curing, thixotropic epoxy that is used for potting, damming, staking, and bonding circuit board components, metals, and plastics. It offers low shrinkage, good dielectric properties, and environmental protection.

Documents

SDS EP1325
TDS EP1325

Available Sizes

Size Part #
1 gal EP1325 BLACK GL Request a Quote

Additional sizes and custom packaging solutions available. Learn more