ResinLab SEC1244 Electrically Conductive Adhesive

ResinLab SEC1244 is a silver-filled, two component, elevated temperature curing epoxy adhesive. It provides excellent electrical conductivity useful in many electronic applications. It is a smooth, 100% solids thixotropic solvent free paste provided in a 1:1 weight ratio. Features a very high thermal conductivity due to its high loading of pure silver.
For sizes and pricing please contact a ResinLab representative.

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Documents

SDS SEC1244 Part A
SDS SEC1244 Part B
TDS SEC1244 A/B

Additional sizes and custom packaging solutions available. Learn more