Thermally Conductive Encapsulants

Thermally Conductive Encapsulants Series
ResinLab thermally conductive encapsulants are designed to help dissipate heat from sensitive electronic components to extend the life span of devices. Most standard systems contain aluminum oxide filler, reducing physical stresses during thermal cycling. We maximize thermal conductivity by using a unique distribution of particles allowing for the highest filler content, while maintaining relatively low viscosity.

For even higher performance, we offer a range of custom resin systems containing fillers such as boron nitride and aluminum nitride.

ProductColorHardness (Shore D)Pot LifeShear Strength (psi)Specific GravityTemperature RangeViscosity (cps)
EP1200 BlackBlack7523min1,6001.98-40 - 150 °C36,000
EP1200LV BlackBlack7015 - 20min1,1001.61-40 - 150 °C25,000
EP1285 BlackBlack90 - 95Varies900 - 2,7002.27Varies8,000 - 120,000


Contact an experienced representative for more information on ResinLab thermally conductive encapsulants or request a quote.


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