Thermally Conductive Encapsulants

Thermally Conductive Encapsulants Series
ResinLab thermally conductive encapsulants are designed to help dissipate heat from sensitive electronic components to extend the life span of devices. Most standard systems contain aluminum oxide filler, reducing physical stresses during thermal cycling. We maximize thermal conductivity by using a unique distribution of particles allowing for the highest filler content, while maintaining relatively low viscosity.

For even higher performance, we offer a range of custom resin systems containing fillers such as boron nitride and aluminum nitride.

ProductColorViscosity (cps)Pot LifeHardness (Shore D)Specific GravityShear Strength (psi)Temperature RangeTk (W/m.K)
EP1200 BlackBlack36,00023min751.981,600-40 - 150 °C0.6
EP1200LV BlackBlack25,00015 - 20min701.611,100-40 - 150 °C0.4
EP1285 BlackBlack8,000 - 120,000Varies902.27900 - 2,700Varies0.8 to 1.2
EP1350 BlackBlack6,00012 - 16h901.97--55 - 230 °C0.7


Contact an experienced representative for more information on ResinLab thermally conductive encapsulants or request a quote.


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