ResinLab EP1026T3 is a two component, room and elevated temperature curing, unfilled, epoxy adhesive paste that is used for rapid bonding of plastics, metal, and ceramics. It is semi-rigid, non-sagging, and resistant to salt spray, water, organic, and inorganic solvents. 1:1 mix ratio.
|50 mL||EP1026T3 50ML||Request a Quote||Buy Now|
Additional sizes and custom packaging solutions available. Learn more