ResinLab EP1320 Black is a one component, heat curing, high build, 100% solid epoxy adhesive. It can be used as a small mass potting compound, the “fill” in a “dam and fill” application structural adhesive, or a dielectric insulating polymer system where the application requires low shrinkage and excellent adhesion to a wide variety of plastics, metals, and circuit board materials. Offers good environmental protection over a wide temperature range.
For sizes and pricing please contact a ResinLab representative.
Additional sizes and custom packaging solutions available. Learn more