ResinLab EP1320LV Black is a one component, heat curing, thixotropic epoxy that is used for potting, damming, staking, and bonding circuit board components, metals, and plastics. It offers low shrinkage, good dielectric properties, and environmental protection. The LV version provides lower high shear viscosity (higher press flow rate).
For sizes and pricing please contact a ResinLab representative.
Additional sizes and custom packaging solutions available. Learn more