EP1325 BLACK GL
ResinLab EP1325 Black is a one component, heat curing, thixotropic epoxy that is used for potting, damming, staking, and bonding circuit board components, metals, and plastics. It offers low shrinkage, good dielectric properties, and environmental protection.
|1 gal||EP1325 BLACK GL||Request a Quote|
Additional sizes and custom packaging solutions available. Learn more