EP1330 GL

ResinLab EP1330 Black Thermally Conductive Adhesive

ResinLab EP1330 Black is a one component, heat curing, epoxy polymer system that is used for staking, damming, potting, and bonding circuit board components, metals, and plastics. It offers high thermal conductivity, semi-free flowing, low shrinkage, and self leveling properties.


SDS EP1330
TDS EP1330
Brochure Electronic Applications

Available Sizes

Size Part #
1 gal EP1330 GL Request a Quote

Additional sizes and custom packaging solutions available. Learn more