ResinLab EP1330 Black is a one component, heat curing, epoxy polymer system that is used for staking, damming, potting, and bonding circuit board components, metals, and plastics. It offers high thermal conductivity, semi-free flowing, low shrinkage, and self leveling properties.
|1 gal||EP1330 GL||Request a Quote|
Additional sizes and custom packaging solutions available. Learn more