ResinLab EP1330LV Black is a one component, thermally conductive, heat cure epoxy polymer system. This product can also be used as a small mass potting (<50 g) “glob top coating” or the fill in a “dam and fill” application. It is recommended for applications requiring high thermal conductivity, low shrinkage, low CTE, and excellent adhesion to a wide variety of plastics, metals, and circuit board materials.
For sizes and pricing please contact a ResinLab representative.
Additional sizes and custom packaging solutions available. Learn more