EP691F CLEAR - A GL

ResinLab EP691F Clear Epoxy Encapsulant

ResinLab EP691F Clear is a two component, room temperature or heat curing, epoxy encapsulant that is used for medium to large castings and filling voids. It is electronic grade, rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents.

Documents

SDS EP691F Part A
SDS EP691F Part B
TDS EP691F A/B

Available Sizes

Size Part #
1 gal EP691F CLEAR - A GL Request a Quote Buy Now
5 gal EP691F CLEAR - A PL Request a Quote
1 gal EP691F CLEAR - B GL Request a Quote Buy Now
5 gal EP691F CLEAR - B PL Request a Quote

Additional sizes and custom packaging solutions available. Learn more