EP965 BLACK - A QT

ResinLab EP965 Black Epoxy Encapsulant

ResinLab EP965 Black is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents.

Documents

SDS EP965 Part A
SDS EP965 Part B
TDS EP965 A/B

Available Sizes

Size Part #
1 qt EP965 BLACK - A QT Request a Quote Buy Now
1 gal EP965 BLACK - A GL Request a Quote Buy Now
5 gal EP965 BLACK - A PL Request a Quote Buy Now
1 qt EP965 BLACK - B QT Request a Quote Buy Now
1 gal EP965 BLACK - B GL Request a Quote Buy Now
5 gal EP965 BLACK - B PL Request a Quote Buy Now
50 mL EP965 BLACK 50ML Request a Quote Buy Now
400 mL EP965 BLACK 400ML Request a Quote Buy Now
600 mL EP965 BLACK 600ML Request a Quote Buy Now

Additional sizes and custom packaging solutions available. Learn more