ResinLab EP965LVLX Clear Epoxy Encapsulant

ResinLab EP965LVLX Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for small to medium casting, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents.

Available Sizes

Size Part #
50 mL EP965LVLX CLEAR 50ML Request a Quote Buy Now
600 mL EP965LVLX CLEAR 600ML Request a Quote Buy Now

Additional sizes and custom packaging solutions available. Learn more