ResinLab EP965SC7 Clear Epoxy Encapsulant

ResinLab EP965SC7 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents.

Available Sizes

Size Part #
5 gal EP965SC7 CLEAR - A PL Request a Quote Buy Now
5 gal EP965SC7 CLEAR - B PL Request a Quote Buy Now
50 mL EP965SC7 CLEAR 50ML Request a Quote Buy Now
400 mL EP965SC7 CLEAR 400ML Request a Quote

Additional sizes and custom packaging solutions available. Learn more