EP965SC7 CLEAR - A PL
ResinLab EP965SC7 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents.
|5 gal||EP965SC7 CLEAR - A PL||Request a Quote||Buy Now|
|5 gal||EP965SC7 CLEAR - B PL||Request a Quote||Buy Now|
|50 mL||EP965SC7 CLEAR 50ML||Request a Quote||Buy Now|
|400 mL||EP965SC7 CLEAR 400ML||Request a Quote|
Additional sizes and custom packaging solutions available. Learn more